首页 产品中心IC 测试座E-TEC BGA Test and Burn-In Socket
　

• Any package style: ceramic & plastic BGA, CSP, LGA, CGA, PSGA, MLF/QFN,QFP, SOIC, and other standard packages, custom packages or bare die

• Inductance: less than 2nH

• -1dB bandwidth: >14GHz for compression style; 3GHz for SMD style

• available for any chip size and grid pattern

• Same PCB layout as the IC (no holes required for SMD socket)

• Minimal keepout area of 6mm beyond the IC’s periphery

• Raised SMD style for lifting socket over adjacent components

• Low profile socket (standard Twist Lock is less than 10mm high with IC)

• Contact force: max 40 grams per contact; lower forces available

• Semi-custom design = lower cost and tailored to your needs

• IC_BGA sockets - top view dimensions
• IC_BGA - BGA socket summary
• IC_BGA - Recommended reflow profile
• IC_BGA - Socket Mounting Recommendations
• IC_BGA adapter - solderball sockets
• IC_BGA test report - 0.80 mm pitch BGA sockets
• IC_BGA test report - 1.00mm pitch BGA sockets
• IC_General specifications
• E-tec / Sempac Alliance for Prototyping sockets & chip packages

常用BGA脚位图(FPGA Package)