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 测试座 |
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烧录座、适配器 |
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高品质电源产品 |
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相关产品 |
| TSOP封装老化测试座 |
| SOP封装贴片测试座 |
| QFP封装老化测试座 |
| QFP封装贴片测试座 |
| QFN(MLF)封装老化测试座 |
| BGA封装老化测试座 |
| BGA封装贴片测试座 |
| CSP封装老化测试座 |
| SOT / TO封装老化测试座 |
| PLCC封装老化测试座 |
| DIP封装老化测试座 |
| SOJ封装老化测试座 |
| PGA封装老化测试座 |
您现在的位置:E-TEC BGA Test and Burn-In Socket
(高频测试座,测试座,老化测试座)
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BGA/LGA/CGA/QFN/QFP高频测试插座产品分球形出脚(SMT)和针形出脚及接触式三种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA
Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.部分BGA插座货期更短至2-3周。并可根据客户的BGA器件出脚，定制合适的BGA插座(Available
for any chip size and grid pattern)。
产品特点:
产品特点:-
Any package style: ceramic & plastic BGA, CSP, LGA, CGA, PSGA, MLF/QFN,QFP, SOIC, and other standard packages, custom packages or bare die
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Inductance: less than 2nH
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-1dB bandwidth: >14GHz for compression style; 3GHz for SMD style(10GHz with speical HF pin)
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available for any chip size and grid pattern
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Same PCB layout as the IC (no holes required for SMD socket)
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Minimal keepout area of 6mm beyond the IC’s periphery
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Raised SMD style for lifting socket over adjacent components
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Low profile socket (standard Twist Lock is less than 10mm high with IC)
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Contact force: max 40 grams per contact; lower forces available
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Semi-custom design = lower cost and tailored to your needs
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| Twist Lock | Fast Lock | Clamshell |
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| Elastomer sockets | Knob Lock | Solderless Compression Type |
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| Quick Lock | QFN / MLF / MLP Socket | Sockets with SMT solderball adapters |
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| ZIF Lever Lock | QFP/PQFP/SOIC/SO etc | BGA Adapters |
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LGA to BGA converter plates For applications where a chip is tested with & without solderballs the LGA sockets can be delivered with a converter plate to allow socketing BGA chips with an LGA socket. |
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BGA Socket
Accessories & Spcecial Features BGA测试插座配件 |
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E-tec Presentation - BGA
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IC_BGA sockets - top view
dimensions
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IC_BGA - BGA socket summary
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IC_BGA - Recommended reflow
profile
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IC_BGA - Socket Mounting
Recommendations
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IC_BGA
adapter - solderball sockets
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IC_BGA test report - 0.80 mm
pitch BGA sockets
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IC_BGA test report - 1.00mm
pitch BGA sockets
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IC_General specifications
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E-tec / Sempac Alliance for
Prototyping sockets & chip packages
常用BGA脚位图(BGA / LGA / CGA Package)
| Package | Socket Type | Part Number | Mechanical Drawing |
|---|---|---|---|
| BGA100,0.65mm Pitch | Clameshell,接触式 | BUC100-0690-10AA55L | BUC100-0690-10AA55L.pdf |
| BGA100,0.65mm Pitch | Twist Lock,接触式 | BUP100-0690-10AL55L | BUP100-0690-10AL55L.pdf |
| BGA132,1.27mm Pitch | Fast Lock,针型出脚 | BPF132-1270-14AA95 | BPF132-1270-14AA95.pdf |
| BGA169 0.5mm Pitch | Fast Lock,接触式 | BPF169-0530-13AA95L | BPF169-0530-13AA95L.pdf |
| BGA256,1.0mm Pitch | Fast Lock,针型出脚 | BPF256-1070-20AA95 | BPF256-1070-20AA95.pdf |
| BGA256,0.8mm Pitch | Fast Lock,Elastomer类型 | EBF256-0891-16AA55L | EBF256-0891-16AA55L.pdf |
| BGA352,1.27mm Pitch | Fast Lock,针型出脚 | BPF352-1270-26AB95 | BPF352-1270-26AB95.pdf |
| BGA353,1.27mm Pitch | Fast Lock,接触式 | BPF353-1229-23AA95+L | BPF353-1229-23AA95+L.pdf |
| BGA360,1.27mm Pitch | Fast Lock,针型出脚 | BCF360-1270-19AA95 | BCF360-1270-19AA95.pdf |
| LGA360,1.27mm Pitch | Fast Lock,针型出脚 | LCF360-1270-19AA95 | LCF360-1270-19AA95.pdf |
| BGA361,1.27mm Pitch | Fast Lock,接触式 | BPF361-1290-19AA55L | BPF361-1290-19AA55L.pdf |
| BGA360,1.0mm Pitch | Twist Lock,接触式,升高设计 | BPW360-1029-22AC95+L | BPW360-1029-22AC95+L.pdf |
| BGA393,0.5mm Pitch | Twist Lock,接触式 | BUP393-0590-29AA55L | BUP393-0590-29AA55L.pdf |
| BGA393,0.5mm Pitch | Fast Lock,接触式 | BUB393-0590-29AL55L | BUB393-0590-29AL55L.pdf |
| LGA429,1.27mm Pitch | Fast Lock,针型出脚 | LPF429-1270-21AB95 | LPF429-1270-21AB95.pdf |
| BGA441,0.8mm Pitch | Twist Lock,球型出脚 | BUW441-0830-23AL95+L | BUW441-0830-23AL95+L.pdf |
| BGA480,1.27mm Pitch | Twist Lock,接触式 | BPW480-1290-29AL55L | BPW480-1290-29AL55L.pdf |
| BGA480,1.27mm Pitch | Clameshell,接触式 | BCC480-1290-29AA55L | BCC480-1290-29AA55L.pdf |
| BGA484,1.27mm Pitch | Fast Lock,接触式 | BCF484-1290-22AAA55L | BCF484-1290-22AAA55L.pdf |
| BGA532,0.8mm Pitch | Clameshell,球型出脚 | BPC532-0830-26AA95+L | BPC532-0830-26AA95+L.pdf |
| CGA560,1.27mm Pitch | Fast Lock,球型出脚 | CCF560-1230-33AB95+L | CCF560-1230-33AB95+L.pdf |
| BGA560,1.27mm Pitch | Fast Lock,球型出脚 | BPF560-1230-33AB95+L | BPF560-1230-33AB95+L.pdf |
| BGA676,1.0mm Pitch | Clameshell,球型出脚 | BPC676-1030-26AA95+L | BPC676-1030-26AA95+L.pdf |
| BGA697,1.0mm Pitch | Fast Lock,球型出脚 | BPF697-0830-29AA95+L | BPF697-0830-29AA95+L.pdf |
| BGA697,1.0mm Pitch | Fast Lock,球型出脚,升高设计 | BPF697-0829-29AA95+L | BPF697-0829-29AA95+L.pdf |
| CGA717,1.27mm Pitch | Twist Lock,球型出脚 | CCW717-1230-27AA95+L | CCW717-1230-27AA95+L.pdf |
| CGA717,1.27mm Pitch | Twist Lock,针型出脚 | CCW717-1270-27AA95 | CCW717-1270-27AA95.pdf |
| BGA1121,1.0mm Pitch | Fast Lock,针型出脚,升高设计 | BUF1121-1029-39AA95H+L | BUF1121-1029-39AA95H+L.pdf |
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