|
Over View |
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Solderless
compression type sockets are available for any
chip size and grid pattern.
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Easily mounted to
the PCB with 4 through hole mounting pegs.
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The assembly board
ensures perfect coplanarity of the socket.
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Contact reliability
is guaranteed with spring loaded gold plated
contacts, which are pressed onto gold plated PCB
pads.
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Solderless
compression type sockets are generally supplied
with a screw lock retention system.
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Custom versions
available.
 Solderless/Compression
Type BGA Socket Data Sheet
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MECHANICAL
DATA |
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Contact life:
|
10,000 cycles min. |
|
Retention System
life: |
10,000 cycles min. |
|
Solderability:
|
exceeds MIL-STD-202 Method
208 |
|
Individual contact
force: |
40 grams max. |
|
|
MATERIAL |
|
Insulator (RoHS
Compliant): |
High temp plastic or epoxy
FR4 |
|
Terminal (RoHS
compliant): |
Brass |
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Contact (RoHS
compliant): |
BeCu |
|
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ELECTRICAL
DATA |
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Contact resistance:
|
< 100 mΩ |
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Current rating:
|
500 mA max. |
|
Insulation
resistance
at 500V DC: |
100 MΩ if 0.50 to 0.80mm
pitch
500 MΩ 1.00mm pitch upwards |
|
Breakdown voltage
at 60 Hz: |
500V min. |
|
Capacitance:
|
< 1 pF |
|
Inductance:
|
< 2 nH |
|
Operating
temperature: |
-55°C to +125°C ; 260°C for
60 sec. |
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