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Your Position : IC Test and Burn-In Socket |
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ENPLAS,YAMAICHI,3M,TI,Wells-cti,Plastronics,Advanced
Interconnection BGA Socket,Meritec SOP Socket. PKG
include:BGA,CSP,PGA,QFN,LGA,QFP,TSOP,SOP,PLCC,SOT,SOJ,TO..
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BGA
Socket |
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Pitch=1.5mm,1.27mm,1.00mm,0.8mm,0.75mm,0.65mm.0.5mm
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IC Test and Burn-In Socket - LingMei Electronic |
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BGA
Surface Mount Socket |
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No soldering of the BGA device required.
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Same footprint as BGA device.
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Compact, low-profile design maximizes PC
board space and requires no external
hold-downs.
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Hundreds of footprints available from 1.5mm
down to 0.75mm pitch.
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IC Test and Burn-In Socket - LingMei Electronic |
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QFN
Socket \ MLF socket |
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Available in .40, .50, .65, .80 and 1.00 mm
pitches
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Custom pitches down to .30 mm
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Lidded and Open Top Sockets for 3 mm - 10 mm
packages
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Hundreds of footprints available from 1.5mm
down to 0.75mm pitch.
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Lidded Sockets for 10 - 16 mm packages
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Center ground pin standard for all sockets
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Optional copper heat slug available for high
wattage devices
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Sockets for over 80 different JEDEC standard
footprints
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IC Test and Burn-In Socket - LingMei Electronic |
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PGA
Socket |
2.54mm and 1.27mm.
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IC
Test and Burn-In Socket - LingMei Electronic |
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QFP
Socket |
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Pin counts 32 to 304
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Pitch sizes 0.4, 0.5, 0.635, 0.65, 0.8 and 1.0mm
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High reliability, durability and temperature
range
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Custom made also available for high pin
count and fine
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IC
Test and Burn-In Socket - LingMei Electronic |
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SOP
Socket |
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Pin Count:16
to 88
Pitch:0.5
to 1.27
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IC
Test and Burn-In Socket - LingMei Electronic |
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TSOP
Socket |
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IC
Test and Burn-In Socket - LingMei Electronic |
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SOP
Surface Mount
Socket |
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980020-48-01,980020-48-02
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IC
Test and Burn-In Socket - LingMei Electronic |
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DIP
Socket |
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IC
Test and Burn-In Socket - LingMei Electronic |
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SOJ
Socket |
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IC
Test and Burn-In Socket - LingMei Electronic |
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PLCC
Socket |
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IC
Test and Burn-In Socket - LingMei Electronic |
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SOT
Socket |
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IC
Test and Burn-In Socket - LingMei Electronic |
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TO
Socket |
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IC
Test and Burn-In Socket - LingMei Electronic |
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