BGA测试座,BGA测试治具,BGA芯片测试座,BGA SOCKET,BGA Test Socket
0.8mm BGA Socket
× 首页 > MCS Test and Burning Socket > BGA Socket  > 0.8mm BGA Socket

BGA SOCKET
您现在的位置:0.8mm BGA Socket

0.8 Pitch BGA Burn-In Socket

PITCH I/O GRID Device Size Socket Size Remarks
(L × W × H)
0.8

×

0.8		 36 4 × 9 4.0 × 9.0 26

×

19.5

×

15.4		 　
48 6 × 8 6.0 × 8.0 　
48 6 × 8 8.0 × 10.0 　
48 6 × 8 8.0 × 13.0 Detail Drawing
49 7 × 7 6.0 × 6.0 　
54 6 × 9 5.5 × 8.0 　
54 9 × 9 8.0 × 11.0 　
54 9 × 9 8.0 × 8.0 Detail Drawing
56 8 × 8 10.0 × 12.0 Detail Drawing
60 6 × 15 8.5 × 13.0 　
60 9 × 10 8.1 × 9.3 Detail Drawing
64 8 × 8 9.0 × 9.0 　
69 10 × 10 9.0 × 12.5 　
69(56) 8 × 8 8.0 × 11.6 Detail Drawing
73 8 × 8 8.0 × 12.0 　
77 8 × 14 7.0 × 12.0 　
78 10 × 13 9.0 × 11.0 　
84 9 × 15 10.0 × 12.5 　
84 9 × 15 9.3 × 13.5 　
84 10 × 16 9.3 × 13.5 　
80(72) 8 × 9 11.0 × 10.0 Detail Drawing
80 8 × 13 8.0 × 12.0 　
81(56) 8 × 8 10.8 × 10.4 　
81 12 × 12 10.8 × 10.4 Detail Drawing
90 9 × 15 11.0 × 18.0 　
92 10 × 18 9.3 × 15.1 　
92 10 × 18 10.5 × 18.0 Detail Drawing
93 10 × 12 8.0 × 11.0 　
93(80) 8 × 10 8.0 × 11.0 Detail Drawing
88 10 × 12 8.0 × 11.6 　
180 (Max) 10 × 18 11.5 × 18.0 　
Acceptable

Ball Size

 Operation

Temperature

 Actuating force Full Matrix Device Size
0.35 ~ 0.50 -55℃ ~ 150℃ 2.6㎏±1㎏ 10 × 18 11.5 × 18.0
PITCH I/O GRID Device Size Socket Size Remarks
(L × W × H)
0.8

×

0.8		 54 9 × 9 11.5 × 10.0 22

×

26

×

15.4		 Detail Drawing
56 8 × 8 11.0 × 8.0 　
60 9 × 10 11.5 × 9.0 　
69 10 × 10 11.0 × 8.0 　
72 12 × 18 11.0 × 8.0 　
84 9 × 15 12.3 × 14.5 Detail Drawing
90 10 × 18 10.0 × 18.0 　
92 10 × 18 13.4 × 15.1 Detail Drawing
93 10 × 12 10.0 × 12.0 　
108 13 × 13 13.0 × 13.0 　
112 11 × 11 11.0 × 11.0 　
121 11 × 11 10.0 × 10.0 　
124 12 × 12 11.0 × 11.0 　
127 10 × 18 10.0 × 18.0 　
144 13 × 13 13.0 × 13.0 　
150 10 × 17 10.6 × 16.1 　
196 14 × 14 12.0 × 12.0 　
256 16 × 16 13.0 × 13.0 　
320 (Max) 16 × 20 14.0 × 18.0 　
Acceptable

Ball Size

 Operation

Temperature

 Actuating force Full Matrix Device Size
0.35 ~ 0.50 -55℃ ~ 150℃ 3.1㎏±1㎏ 16 × 20 14.0 × 18.0
PITCH I/O GRID Device Size Socket Size Remarks
(L × W × H)
0.8

×

0.8		 40 4 × 11 8.0 × 13.0 20

×

20

×

15.4		 Detail Drawing
48 6 × 8 8.0 × 13.0 Detail Drawing
48 6 × 8 8.0 × 9.0 Detail Drawing
48 6 × 8 8.0 × 13.0 Detail Drawing
54 9 × 8 9.0 × 8.0 Detail Drawing
54 9 × 9 8.0 × 8.0 Detail Drawing
69 10 × 10 8.0 × 11.6 Detail Drawing
144 12 × 12 12.0 × 12.0 Detail Drawing
144 14 × 14 13.0 × 13.0 Detail Drawing
159 11 × 11 14.0 × 14.0 Detail Drawing
169 11 × 11 13.0 × 13.0 Detail Drawing
179 12 × 12 14.0 × 14.0 Detail Drawing
196 (Max) 14 × 14 12.0 × 12.0 Detail Drawing
Acceptable

Ball Size

 Operation

Temperature

 Actuating force Full Matrix Device Size
0.35 ~ 0.50 -55℃ ~ 150℃ 2.7㎏±1㎏ 14 × 14 12.0 × 12.0
PITCH I/O GRID Device Size Socket Size Remarks
(L × W × H)
0.8

×

0.8		 60 6 × 11 12.0 × 14.0 20.0 × 28.0 × 15.4 　
68 6 × 11 11.9 × 20.9 　
84 9 × 15 12.0 × 14.0 　
315 (Max) 15 × 21 14.0 × 22.0 　
Acceptable

Ball Size

 Operation

Temperature

 Actuating force Full Matrix Device Size
0.35 ~ 0.50 -55℃ ~ 150℃ 3.3㎏±1㎏ 15 × 21 14.0 × 22.0
深圳市菱美电子有限公司 版权所有 　Email:sales@lm-connector.com