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Series: IC51 - Clamshell |
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Title: Quad Flat Package (QFP, PQFP, TQFP
and MQUAD)) |
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Features |
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Pitch sizes 0.4, 0.5, 0.65, 0.8 and
1.0mm
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High reliability, durability and
temperature range
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Custom made also available for high
pin count and fine-pitch IC packages
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Specifications |
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Insulation Resistance: |
1,000M
min. at 100V DC, 500V DC |
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Dielec. Withstd. Voltage: |
for 1 minute at 100V AC, 500V AC, 700V
AC (socket
dependent) |
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Contact Resistance: |
30m
max. at 10mA/20mV max. |
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Operating Temp. Range: |
(PEI/PSF) –40°C to +150°C
(PES) -55°C
to +170°C
(PEI)
-55°C to +170°C |
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Materials
and Finish |
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Housing: |
Polysulphone (PSF)
Polyethersulphone (PES)
Polyetherimide (PEI) |
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Contacts: |
Beryllium Copper (BeCu) |
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Plating: |
Gold over Nickel |
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Click on
Data Sheet for further information about:
-Part
Number Details
-Socket
Dimensions
-PCB
Layout
Full Data Sheet |
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PDF file size: 102KB |
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Series: IC51 - Clamshell |
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Title: Plastic Lead Chip Carrier (PLCC) |
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Features |
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Pin counts 20, 28, 32, 44, 52, 68,
84, 100 and 124
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Clamshell socket for PLCC packages
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Specifications |
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Insulation Resistance: |
1,000M
min. at 500V DC |
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Dielec. Withstd. Voltage: |
700V AC for 1 minute |
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Contact Resistance: |
30m
max. at 10mA/20mV max. |
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Current Rating: |
1A max. |
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Operating Temp. Range: |
–55°C to +170°C |
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Mating Cycles: |
10,000 insertions |
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Materials and Finish |
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Housing: |
Polyethersulphone (PES), glass-filled |
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Contacts: |
Beryllium Copper (BeCu) |
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Plating: |
Gold over Nickel |
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Series: IC51 - Clamshell |
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Title: Small Outline Package
(SOP) |
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Features |
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Pitch sizes 0.8, 1.25 and
1.27mm
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Specifications |
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Insulation Resistance: |
1,000M
min. at 500V DC |
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Dielec. Withstd. Voltage: |
700V AC for 1 minute |
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Contact Resistance: |
30m
max. at 10mA/20mV max. |
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Operating Temp. Range: |
–40°C to +150°C
(type PSF)
–55°C to +170°C
(type PES & PEI) |
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Mating Cycles: |
10,000 insertions min. |
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Materials and Finish |
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Housing: |
Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-
filled
Polyetherimide (PEI),
glass-filled |
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Contacts: |
Beryllium Copper (BeCu) |
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Plating: |
Gold over Nickel |
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Click on Data Sheet for further
information about:
-Part Number Details
-Socket Dimensions
-IC Dimensions
-PCB Layout
Full Data Sheet |
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PDF file size: 103KB |
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Series: IC51 - Clamshell |
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Title: Shrink Small Outline
Package (SSOP) |
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Features |
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Pin counts 16, 20, 24, 28, 30, 32,
48 and 56
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Pitch sizes 0.6, 0.635 and 0.65mm
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Clamshell socket for SSOP
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Specifications |
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Insulation Resistance: |
1,000M
min. at 500V DC |
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Dielec. Withstd. Voltage: |
700V AC for 1 minute |
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Contact Resistance: |
30m
max. at 10mA/20mV max. |
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Operating Temp. Range: |
–40°C to +150°C
(type PSF)
–55°C to +170°C
(type PES & PEI) |
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Mating Cycles: |
10,000 insertions min. |
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Materials and Finish |
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Housing: |
Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass- filled
Polyetherimide (PEI), glass-filled |
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Contacts: |
Beryllium Copper (BeCu) |
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Plating: |
Gold over Nickel |
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Click on Data Sheet for further
information about:
-Part Number Details
-IC Dimensions
Full Data Sheet |
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PDF file size: 25KB |
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Series: IC53 / IC51 - Lid Type |
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Title: Leadless Chip Carrier (LCC) |
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Features |
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Pin counts for IC53, 16, 18,20, 24,
28, 32, 44 and 48
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Pin counts for IC51, 52 and 68
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Pitch size 1.016 and 1.27mm
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Lid type sockets for LCC packages
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Specifications |
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Insulation Resistance: |
1,000M
min. at 500V DC |
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Dielec. Withstd. Voltage: |
700V AC for 1 minute |
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Contact Resistance: |
30m
max. at 10mA/20mV max. |
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Current Rating: |
1A max. |
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Operating Temp. Range: |
–40°C to +150°C |
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Mating cycles: |
10,000 insertions min. |
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