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产品中心-YAMAICHI  IC51系列测试/老化插座
　
YAMAICHI  IC51 Series Test and Burn-In Socket


　

　

　

　

　

　


 首页 YAMAICHI SocketIC51 Series Socket 

您现在的位置:IC测试座 - IC51 Series Socket

Click on Data Sheet for further information about:
-Part Number Details
-Socket Dimensions
-IC Dimensions
-PCB Layout

 

32 to 54 pins
(PDF file size: 132KB)
.
56 to 64 pins
(PDF file size: 143KB)
.
68 to 100 pins
(PDF file size: 160KB)
.
112 to 144 pins
(PDF file size: 164KB)
.
160 to 184 pins
(PDF file size: 127KB)
.
208 to 304 pins
(PDF file size: 186KB)
.
MQUAD 208 to 304
(PDF file size: 95KB)
.
　
Series: IC51 - Clamshell
Title: Quad Flat Package (QFP, PQFP, TQFP and MQUAD))
  　
Features 　
  • Pin counts 32 to 304
  • Pitch sizes 0.4, 0.5, 0.65, 0.8 and 1.0mm
  • High reliability, durability and temperature range
  • Custom made also available for high pin count and fine-pitch IC packages
　 　
Specifications 　
Insulation Resistance: 1,000M min. at 100V DC, 500V DC
Dielec. Withstd. Voltage: for 1 minute at 100V AC, 500V AC, 700V AC (socket dependent)
Contact Resistance: 30m max. at 10mA/20mV max.
Operating Temp. Range: (PEI/PSF) –40°C to +150°C
(PES) -55°C to +170°C
(PEI)  -55°C to +170°C
　 　
Materials and Finish 　
Housing: Polysulphone (PSF)
Polyethersulphone (PES)
Polyetherimide (PEI)
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
　
 
　
Click on Data Sheet for further information about: 
-Part Number Details
-Socket Dimensions 
-IC Dimensions 
-PCB Layout 

Full Data Sheet

PDF file size: 93KB
　
Series: IC51 - Clamshell
Title: Bumper Quad Flat Package (BQFP)
  　
Features 　
  • Pin counts 100, 132, 164 and 196
  • Pitch size 0.635mm
  • Clamshell socket for BQFP devices
　 　
Specifications 　
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 700C AC for 1minute
Contact Resistance: 30m max. at 10mA/20mV max.
Operating Temp. Range: –55°C to +170°C
Mating Cycles: 25,000 insertions min.
Contact Force: 50g min. per pin at min. 
displacement of 0.3mm 
150g max. per pin at max. 
displacement of 0.7mm
　 　
Materials and Finish 　
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
　
　
 
　
Click on Data Sheet for further information about: 
-Part Number Details
-Socket Dimensions 
-PCB Layout 

Full Data Sheet

PDF file size: 102KB
　
Series: IC51 - Clamshell
Title: Plastic Lead Chip Carrier (PLCC)
  　
Features 　
  • Pin counts 20, 28, 32, 44, 52, 68, 84, 100 and 124
  • Pitch size 1.27mm
  • Clamshell socket for PLCC packages
　 　
Specifications 　
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 700V AC for 1 minute
Contact Resistance: 30m max. at 10mA/20mV max.
Current Rating: 1A max.
Operating Temp. Range: –55°C to +170°C
Mating Cycles: 10,000 insertions
　 　
Materials and Finish 　
Housing: Polyethersulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
　
Click on Data Sheet for further information about:
-Part Number Details
-Socket Dimensions
-IC Dimensions
-PCB Layout

 

8 to 18 pins
(PDF file size: 100KB)
.
20 to 24 pins
(PDF file size: 92KB)
.
26 to 32 pins
(PDF file size: 101KB)
.
34 to 56 pins
(PDF file size: 94KB)
.
　
Series: IC51 - Clamshell
Title: Small Outline Package (SOP)
  　
Features 　
  • Pin counts 8 to 56
  • Pitch sizes 0.8, 1.25 and 1.27mm
  • Clamshell socket for SOP
　 　
Specifications 　
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 700V AC for 1 minute
Contact Resistance: 30m max. at 10mA/20mV max.
Operating Temp. Range: –40°C to +150°C
(type PSF)
–55°C to +170°C
(type PES & PEI)
Mating Cycles: 10,000 insertions min.
　 　
Materials and Finish 　
Housing: Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass- filled
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
　
　
Click on Data Sheet for further information about: 
-Part Number Details
-Socket Dimensions 
-IC Dimensions 
-PCB Layout 

Full Data Sheet

PDF file size: 103KB
　
Series: IC51 - Clamshell
Title: Shrink Small Outline Package (SSOP)
  　
Features 　
  • Pin counts 16, 20, 24, 28, 30, 32, 48 and 56
  • Pitch sizes 0.6, 0.635 and 0.65mm
  • Clamshell socket for SSOP
　 　
Specifications 　
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 700V AC for 1 minute
Contact Resistance: 30m max. at 10mA/20mV max.
Operating Temp. Range: –40°C to +150°C 
(type PSF) 
–55°C to +170°C 
(type PES & PEI)
Mating Cycles: 10,000 insertions min.
　 　
Materials and Finish 　
Housing: Polysulphone (PSF), glass-filled 
Polyethersulphone (PES), glass- filled 
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
　
　
Click on Data Sheet for further information about:
-Part Number Details
-Socket Dimensions
-IC Dimensions
-PCB Layout

Full Data Sheet

PDF file size: 101KB
　
Series: IC51 - Clamshell
Title: Thin Small Outline Package (TSOP Type I and II)
  　
Features 　
  • Pin counts 24 to 50
  • Pitch sizes 0.5, 0.8 and 1.27mm
  • Clamshell socket for TSOP Type I and II
　 　
Specifications 　
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 700V AC for 1 minute
Contact Resistance: 30m max. at 10mA/20mV max.
Operating Temp. Range: –40°C to +150°C (type PSF)
–55°C to +170°C (type PES & PEI)
Mating Cycles: 10,000 insertions min.
　 　
Materials and Finish 　
Housing: Polysulphone (PSF), glass-filled
Polyethersulphone (PES),
glass- filled
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
 
　
Click on Data Sheet for further information about: 
-Part Number Details
-Applicable TAB 
 Sockets and
 Carriers

Full Data Sheet

PDF file size: 28KB
　
Series: IC51 - Clamshell
Title: Tape Carrier Package (TCP/TAB)
  　
Features 　
  • Tape sizes 35, 48 and 70mm
  • Pitch sizes 0.25, 0.3, 0.381, 0.4 and 0.5mm
  • Clamshell socket system for Tape Carrier
　 　
Specifications 　
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 200V AC for 1 minute
Contact Resistance: 30m max. at 10mA/20mV max.
Operating Temp. Range: –40°C to +170°C
　 　
Materials and Finish 　
Housing: Polyethersulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
　
　
 
　
Click on Data Sheet for further information about: 
-Part Number Details
-IC Dimensions 

Full Data Sheet

PDF file size: 25KB
　
Series: IC53 / IC51 - Lid Type
Title: Leadless Chip Carrier (LCC)
  　
Features 　
  • Pin counts for IC53, 16, 18,20, 24, 28, 32, 44 and 48
  • Pin counts for IC51, 52 and 68
  • Pitch size 1.016 and 1.27mm
  • Lid type sockets for LCC packages
　 　
Specifications 　
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 700V AC for 1 minute
Contact Resistance: 30m max. at 10mA/20mV max.
Current Rating: 1A max.
Operating Temp. Range: –40°C to +150°C
Mating cycles: 10,000 insertions min.

　
　

　

　
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