菱美电子提供BGA IC Socket (BGA插座)测试治具及完整BGA IC Total Solution

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常用BGA Burn-In Sockets

FBGA 144

- FBGA 144 ball Burn-In-socket .
- Pitch : 0.8mm
- Full Matrix : 13 x 13
- IC device size : 12mm x 12mm
- Zero Insertion Force
- Self Pin Alignment by loading

FBGA 92

- FBGA 92 ball Burn-In-socket .
- Pitch : 0.8mm
- Full Matrix : 10 x 18
- IC device size : 10.5mm x 18 mm
- Zero Insertion Force
- Self Pin Alignment by loading

BGA 60

- BGA 60 ball Burn-In-socket .
- Pitch : 1.6mm
- Full Matrix : 6 x 10
- IC device size : 13mm x 20mm
- Zero Insertion Force for Device Insertion.
- Self Pin Alignment by loading

FBGA 48

- FBGA 48 ball Burn-In-socket .
- Pitch : 0.8mm
- Full Matrix : 13 x 13
- IC device size : 8mm x 13mm
- Zero Insertion Force for Device Insertion.
- Self Pin Alignment by loading

FBGA 56

- FBGA56 Burn-In Socket
- Pitch : 0.8mm
- Full Matrix : 10*18
- Device Size :10.8mm*10.4
- Zero Insertion Force
- Self Pin Alignment by Loading

0.75 Pitch FBGA52

- FBGA52 Burn-In Socket
- Pitch : 0.75mm
- Full Matrix : 10*19
- IC Device Size :6.6mm*11.0
- Zero Insertion Force
- Self Pin Alignment by Loading

FBGA54

- FBGA54 Burn-In Socket
- Pitch : 0.8mm
- Full Matrix : 10*18
- IC Device Size : 8.0mm*8.0mm
- IC Device Size : 8.1mm*9.3mm
- IC Device Size : 8.1mm*15.1mm
- IC Device Size : 9.5mm*15.5mm
- Zero Insertion Force
- Self Pin Alignment by Loading

FBGA72

- FBGA72 Burn-In Socket
- Pitch : 0.8mm
- Full Metrix : 10*18
- IC Device Size : 10.0mm*11.0mm
- Zero Insertion Force
- Self Pin Alignment by Loading

0.75 Pitch FBGA48

- FBGA48 Burn-In Socket
- Pitch : 0.75mm
- Full Matrix : 10*19
- Device Size : 7.0mm*9.0mm
- Zero Insertion Force
- Self Pin Alignment by Loading

BGA69

- FBGA 69 Burn-In-socket (Matrix:11.6*8.0)
- Pitch : 0.8mm
- Full Matrix : 11.7 x 8.1
- IC device size : 11.6mm x 8mm
- Zero Insertion Force

0.5 Pitch BGA48

- 0.5 Pitch BGA48 (Matrix:10.0*11.0)
- Pitch : 0.5mm
- Full Matrix : 20 x 20
- IC device size : 10.0mm x 11.0mm
- Zero Insertion Force

WBGA92 (22 x 26)

- WBGA 92 Burn-In-socket (Matrix:18.0*8.0)
- Pitch : 0.8mm
- Full Matrix : 16 x 20
- IC device size : 15.1mm x 13.4mm
- Zero Insertion Force

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