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0.65mm BGA Socket
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0.65 Pitch BGA Burn-In Socket

PITCH I/O GRID Device Size Socket Size Remarks
(L × W × H)
0.65

×

0.65		 49 7 × 7 6.0 × 6.0 26

×

26

×

15.4		 　
52 6 × 10 4.5 × 7.0 　
60 7 × 15 6.4 × 10.1 　
83 6 × 14 4.5 × 10.0 　
84 6 × 14 4.5 × 10.0 　
89 10 × 10 7.0 × 7.0 　
90 7 × 15 7.24 × 11.3 　
90 7 × 15 7.3 × 11.3 　
96 10 × 10 7.0 × 7.0 　
100 10 × 10 7.0 × 7.0 　
137 11 × 15 13.0 × 13.0 　
151 21 × 21 14.0 × 14.0 Detail Drawing
154 11 × 14 8.0 × 10.0 　
160 12 × 18 9.0 × 13.0 　
200 19 × 19 13.0 × 13.0 　
208 17 × 17 12.0 × 12.0 　
220 16 × 16 11.0 × 11.0 　
237 19 × 19 13.0 × 13.0 　
320 24 × 24 17.0 × 17.0 　
321 21 × 21 15.0 × 15.0 　
625 (Max) 25 × 25 18.0 × 11.5 　
Acceptable Ball Size Operation Temperature Actuating force Full Matrix Device Size
0.32 ~ 0.50 -55℃ ~ 170℃ 3.5㎏±1㎏ 25 × 25 18.0 × 11.5
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